Concepedia

G.M. Wenger

GW

4

Publications

157

Citations

4

H-Index

1995

Active since

Affiliations

Amkor Technology (United States)(Current)

Universal Instruments (United States)

G.M. Wenger is an author at Amkor Technology (United States) specializing in engineering, electronic packaging, and materials science.

Top concepts

EngineeringMaterial ScienceElectronic PackagingCorrosionMicrostructureMechanical EngineeringApplied PhysicsSurface ScienceMaterials EngineeringMechanics

Publications per year

1995–2003

4

Publications

4

Solder metallization interdiffusion in microelectronic interconnects

A. Zribi, Richard R. Chromik, R. Presthus et al. · IEEE Transactions on Components and Packaging Technologies · 2000 · 60 citations

Engineering, Mechanical Engineering, Solder Metallization Interdiffusion +17

Shear testing and failure mode analysis for evaluation of BGA ball attachment

Robert Erich, Richard Coyle, G.M. Wenger et al. · 2003 · 56 citations

Engineering, Shear Testing, Mechanical Engineering +22

The effect of modifications to the nickel/gold surface finish on assembly quality and attachment reliability of a plastic ball grid array (peer review version)

Richard Coyle, Diane E. Hodges Popps, Andrew Mawer et al. · IEEE Transactions on Components and Packaging Technologies · 2003 · 28 citations

Materials Science, Electrical Engineering, Engineering +14

Thermal Stability of Azole‐Coated Copper Surfaces

R. L. Opila, H. W. Krautter, Bernard R. Zegarski et al. · Journal of The Electrochemical Society · 1995 · 13 citations

Engineering, Chemical Engineering, Corrosion +16

Rows per page

1–4 of 4