Effect of voids on the reliability of BGA/CSP solder joints - Concepedia

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Effect of voids on the reliability of BGA/CSP solder joints

153

Citations

1

References

2003

Year

Mohammad Yunus, K. Srihari, James M. Pitarresi, Anthony Primavera

Microelectronics Reliability

Electrical EngineeringReliability EngineeringEngineeringHardware ReliabilityChip AttachmentElectronic PackagingBga/csp Solder JointsDefect TolerancePhysic Of FailureDevice Reliability

References

	Year	Citations
Soldering in electronics G.W.A.D. Microelectronics Reliability Electrical EngineeringEngineeringAdvanced Packaging (Semiconductors)Chip On BoardChip Attachment	1990	289

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