S.A. Bidstrup-Allen

Silver metallization for advanced interconnects

Rahul Manepalli, F. Stepniak, S.A. Bidstrup-Allen et al. · IEEE Transactions on Advanced Packaging · 1999 · 120 citations

Engineering, Silver Metallization, Silver Metal +19

Factors influencing the permittivity of polymer/ceramic composites for embedded capacitors

S. Ogitani, S.A. Bidstrup-Allen, Paul A. Kohl · IEEE Transactions on Advanced Packaging · 2000 · 106 citations

Engineering, Novolac Epoxy, Chemistry +16

Underfill of flip chip on laminates: simulation and validation

Luu Nguyen, C. Quentin, P. Fine et al. · IEEE Transactions on Components and Packaging Technologies · 1999 · 77 citations

Engineering, Fluid Mechanics, Mechanical Engineering +16

Stresses in thin film metallization

Tom Hodge, S.A. Bidstrup-Allen, Paul A. Kohl · IEEE Transactions on Components Packaging and Manufacturing Technology Part A · 1997 · 66 citations

Engineering, Severe Plastic Deformation, Residual Stress +18

Computational Modeling and Validation of the Encapsulation of Plastic Packages by Transfer Molding

Luu Nguyen, C. Quentin, W. Lee et al. · Journal of Electronic Packaging · 1999 · 43 citations

Transfer Molding, Engineering, Mechanical Engineering +18