Concepedia

Rahul Manepalli

RM

5

Publications

242

Citations

5

H-Index

1999

Active since

Affiliations

Georgia Institute of Technology(Current)

Intel (United States)

Rahul Manepalli is an author at Georgia Institute of Technology specializing in engineering, materials science, and electronic packaging.

Top concepts

EngineeringMaterial ScienceApplied PhysicsElectronic PackagingElectrical Engineering3D PrintingPolymer ScienceSurface ScienceMicroelectronicsMicrofabrication

Publications per year

1999–2021

5

Publications

5

Silver metallization for advanced interconnects

Rahul Manepalli, F. Stepniak, S.A. Bidstrup-Allen et al. · IEEE Transactions on Advanced Packaging · 1999 · 120 citations

Engineering, Silver Metallization, Silver Metal +19

Die Embedding Challenges for EMIB Advanced Packaging Technology

Gang Duan, Yosuke Kanaoka, Robin McRee et al. · 2021 · 64 citations

Die Embedding Challenges, Engineering, Computer Architecture +19

Variable frequency microwave curing of photosensitive polyimides

K.D. Famsworth, Rahul Manepalli, S.A. Bidstrup-Allen et al. · IEEE Transactions on Components and Packaging Technologies · 2001 · 28 citations

Engineering, Optical Properties, Polymer Processing +16

Multilayer planarization of polymer dielectrics

P. Chiniwalla, Rahul Manepalli, K. Farnsworth et al. · IEEE Transactions on Advanced Packaging · 2001 · 20 citations

Engineering, Single Layer Planarization, Polymers +18

Electroanalytical Study of Organic Additive Interactions in Copper Plating and Their Correlation with Via Fill Behavior

Timothy Huang, Himani Sharma, Rahul Manepalli et al. · Journal of Electronic Materials · 2018 · 10 citations

Materials Science, Chemical Engineering, Electroanalytical Study +10

Rows per page

1–5 of 5