Robin McRee is an author at Intel (United States) specializing in electronic packaging, advanced packaging, and electromagnetic compatibility.
Top concepts
3D PrintingEngineeringMicroelectronicsMicrofabricationAdvanced PackagingComputer EngineeringElectronic PackagingComputer ArchitectureElectrical EngineeringHeterogeneous Integration
Publications per year
2021–2021
1
1
Die Embedding Challenges for EMIB Advanced Packaging Technology
Gang Duan, Yosuke Kanaoka, Robin McRee et al. · 2021 · 64 citations
Die Embedding Challenges, Engineering, Computer Architecture +19
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