W. Lee

Computational Modeling and Validation of the Encapsulation of Plastic Packages by Transfer Molding

Luu Nguyen, C. Quentin, W. Lee et al. · Journal of Electronic Packaging · 1999 · 43 citations

Transfer Molding, Engineering, Mechanical Engineering +18

A 62Gb/s backplane interconnect ASIC based on 3.1Gb/s serial-link technology

P. Landman, Ah-Lyan Yee, Runqi Gu et al. · 2002 IEEE International Solid-State Circuits Conference. Digest of Technical Papers (Cat. No.02CH37315) · 2003 · 20 citations

System On Chip, Electrical Engineering, Backplane Interconnect Asic +12

Energy-dispersive, x-ray reflectivity density measurements of porous SiO2 xerogels

Donald Windover, Toh‐Ming Lu, S. L. Lee et al. · Applied Physics Letters · 2000 · 20 citations

Materials Science, Interlayer Dielectric Applications, X-ray Spectroscopy +12

A self-timed method to minimize spurious transitions in low power CMOS circuits

U. Ko, Poras T. Balsara, W. Lee · 2002 · 20 citations

Low-power Electronics, Hardware Security, Electrical Engineering +14

A transmit architecture with 4-tap feedforward equalization for 6.25/12.5Gb/s serial backplane communications

P. Landman, K. Brouse, Vikas Gupta et al. · 2005 · 11 citations

Wireless Communications, Engineering, 4-Tap Feedforward Equalization +13