Fritz Redeker

Comparison of Aluminum Etch Rates in Carbon Tetrachloride and Boron Trichloride Plasmas

K. Tokunaga, Fritz Redeker, D. A. Danner et al. · Journal of The Electrochemical Society · 1981 · 78 citations

Natural Sciences, Materials Engineering, Materials Science +17

Copper CMP integration and time dependent pattern effect

Jianbing Pan, Ping Li, K. Wijekoon et al. · 2003 · 16 citations

Natural Sciences, Materials Engineering, Materials Science +6

PLANARIZATION AND INTEGRATION OF SHALLOW TRENCH ISOLATION

Jhih-Yuan Pan, Dennis O. Ouma, Ping Li et al. · 1998 · 16 citations

Engineering, Electrical Engineering, Materials Engineering +12

Process integration of double level copper-low k (k=2.8) interconnect

M. Naik, S. Parikh, P. Li et al. · 2003 · 14 citations

Engineering, Electrical Engineering, Materials Science +17

Development of a production worthy copper CMP process

K. Wijekoon, Sandeep Kumar Mishra, Stan Tsai et al. · 2002 · 11 citations

Engineering, Materials Engineering, Materials Science +16