M. Naik

Nucleation and growth of CVD Al on different types of TiN

M. Avinun, N Barel, Wayne D. Kaplan et al. · Thin Solid Films · 1998 · 27 citations

Materials Science, Aluminium Nitride, Engineering +10

Through-silicon-via technology for 3D integration

John Dukovic, S. Ramaswami, Sharma Pamarthy et al. · 2010 · 25 citations

3D Ic Architecture, Electrical Engineering, Ic Industry +15

Predicting water quality index using stacked ensemble regression and SHAP based explainable artificial intelligence

Rakesh Choudhary, Ajay Kumar, C. Priyadharsini et al. · Scientific Reports · 2025 · 19 citations · Full text

Process integration of double level copper-low k (k=2.8) interconnect

M. Naik, S. Parikh, P. Li et al. · 2003 · 14 citations

Process Integration, Engineering, Black Diamond +16

CVD Mn-based self-formed barrier for advanced interconnect technology

Yong Kong Siew, N. Jourdan, Y. Barbarin et al. · 2013 · 10 citations

Materials Science, Materials Engineering, Electrical Engineering +15