S. Baudot

First Monolithic Integration of 3D Complementary FET (CFET) on 300mm Wafers

S. Subramanian, M. Reza Hosseini, T. Chiarella et al. · 2020 · 109 citations

Engineering, N14 Platform, Interconnect (Integrated Circuits) +16

Buried Power Rail Integration With FinFETs for Ultimate CMOS Scaling

Anshul Gupta, Olalla Varela Pedreira, Goutham Arutchelvan et al. · IEEE Transactions on Electron Devices · 2020 · 36 citations

Engineering, Vlsi Design, Integrated Circuits +16

Very Low Temperature Epitaxy of Group-IV Semiconductors for Use in FinFET, Stacked Nanowires and Monolithic 3D Integration

Clément Porret, Andriy Hikavyy, Juan Fernando Gomez Granados et al. · ECS Journal of Solid State Science and Technology · 2019 · 29 citations · Full text

New Technologies, Engineering, Monolithic 3D +19

Elastic relaxation in patterned and implanted strained silicon on insulator

S. Baudot, F. Andrieu, F. Rieutord et al. · Journal of Applied Physics · 2009 · 26 citations

Materials Engineering, Materials Science, Electrical Engineering +15

Impact of high temperature annealing on La diffusion and flatband voltage (Vfb) modulation in TiN/LaOx/HfSiON/SiON/Si gate stacks

R. Boujamaa, S. Baudot, N. Rochat et al. · Journal of Applied Physics · 2012 · 24 citations

Engineering, Electronic Properties, Silicon On Insulator +19