Xielin Wang

Intel PowerVia Technology: Backside Power Delivery for High Density and High-Performance Computing

W. Hafez, Prashant Agnihotri, M. Asoro et al. · 2023 · 63 citations

Engineering, Electrical Engineering, High-performance Computing +12

Intel 4 CMOS Technology Featuring Advanced FinFET Transistors optimized for High Density and High-Performance Computing

B. Sell, Seungchan An, Jeffrey L. Armstrong et al. · 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) · 2022 · 43 citations

Engineering, Electrical Engineering, High-performance Computing +17

Understanding stress enhanced performance in Intel 90nm CMOS technology

M.D. Giles, M Armstrong, C. Auth et al. · 2004 · 39 citations

Engineering, Computer Engineering, Electrical Engineering +16

Balancing detectivity and sensitivity of plasmonic sensors with surface lattice resonance

Zhichao Li, Ciril S. Prasad, Xielin Wang et al. · Nanophotonics · 2023 · 18 citations · Full text

Engineering, Materials Engineering, Materials Science +17

Intel 18A Platform Technology Featuring RibbonFET (GAA) and PowerVia for Advanced High-Performance Computing

K. Fischer, Frank E. Abboud, R. Aggarwal et al. · 2025 · 13 citations

Engineering, Computer Engineering, High-performance Computing +17