Kunwoo Park

Osteoconduction at porous hydroxyapatite with various pore configurations

Bong‐Soon Chang, Choon‐Ki Lee, Kug-Sun Hong et al. · Biomaterials · 2000 · 627 citations

Tissue Engineering, Synthetic Bone Substitute, Engineering +6

High-Frequency Scalable Electrical Model and Analysis of a Through Silicon Via (TSV)

Joohee Kim, Jun So Pak, Jonghyun Cho et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2011 · 479 citations

Engineering, Vlsi Design, Scalable Model +17

WAVE: Popularity-based and collaborative in-network caching for content-oriented networks

Kideok Cho, Munyoung Lee, Kunwoo Park et al. · 2012 · 333 citations

Web Cache, Collaborative In-network, Network Science +14

Modeling and Analysis of Through-Silicon Via (TSV) Noise Coupling and Suppression Using a Guard Ring

Jonghyun Cho, Eakhwan Song, Ki-Hyun Yoon et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2011 · 164 citations

Engineering, Through-silicon Via, Interconnect (Integrated Circuits) +16

PDN Impedance Modeling and Analysis of 3D TSV IC by Using Proposed P/G TSV Array Model Based on Separated P/G TSV and Chip-PDN Models

Jun So Pak, Joohee Kim, Jonghyun Cho et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2011 · 128 citations

Engineering, Chip-pdn Models, Power Electronics +16