Junekyun Park

Technology scaling on High-K & Metal-Gate FinFET BTI reliability

Kyong Taek Lee, Wonchang Kang, Eun-Ae Chung et al. · 2013 · 56 citations

Materials Engineering, Electrical Engineering, Engineering +11

Frequency dependent TDDB behaviors and its reliability qualification in 32nm high-k/metal gate CMOSFETs

Kyong Taek Lee, Jongik Nam, Minjung Jin et al. · 2011 · 37 citations

Electrical Engineering, High-k/metal Gate Cmosfets, Engineering +15

Reliability characterization of 10nm FinFET technology with multi-V<inf>T</inf> gate stack for low power and high performance

Minjung Jin, Changze Liu, Jinju Kim et al. · 2016 · 26 citations

Reliability, Low Power, Electrical Engineering +12

Interfacial Degradation Mechanism of Au/Al and Alloy/Al Bonds Under High Temperature Storage Test: Contamination, Epoxy Molding Compound, Wire and Bonding Strength

Jongwoo Park, Hyun-Joon Cha, Back-Sung Kim et al. · IEEE Transactions on Components and Packaging Technologies · 2007 · 24 citations

Engineering, Mechanical Engineering, Corrosion +17

A systematic study of gate dielectric TDDB in FinFET technology

Hyunjin Kim, Minjung Jin, Hyun Chul Sagong et al. · 2018 · 24 citations

Device Modeling, Electrical Engineering, Semiconductor Device +14