Concepedia

Back-Sung Kim

BK

1

Publications

24

Citations

1

H-Index

2007

Active since

Affiliations

Samsung (South Korea)(Current)

Back-Sung Kim is an author at Samsung (South Korea) specializing in mechanical engineering, engineering, and electronic packaging.

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Publications per year

2007–2007

1

Publications

1

Interfacial Degradation Mechanism of Au/Al and Alloy/Al Bonds Under High Temperature Storage Test: Contamination, Epoxy Molding Compound, Wire and Bonding Strength

Jongwoo Park, Hyun-Joon Cha, Back-Sung Kim et al. · IEEE Transactions on Components and Packaging Technologies · 2007 · 24 citations

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