E. Rolland

Interface properties of a-Si:H/c-Si heterojunction solar cells from admittance spectroscopy

Jean‐Paul Kleider, J. Damon-Lacoste, P. Roca i Cabarrocas et al. · Thin Solid Films · 2006 · 45 citations

Electrical Engineering, Engineering, Applied Physics +5

Advances toward reliable high density Cu-Cu interconnects by Cu-SiO₂ direct hybrid bonding

Yann Beilliard, Thomas Signamarcheix, S. Moreau et al. · 2014 · 36 citations

Reliability Study, Engineering, Bonding Quality +17

Optimisation of amorphous and polymorphous thin silicon layers for the formation of the front-side of heterojunction solar cells on p-type crystalline silicon substrates

Y. Veschetti, J. C. Müller, J. Damon-Lacoste et al. · Thin Solid Films · 2006 · 32 citations

Materials Science, Engineering, Perovskite Solar Cell +9

150 mm SiC Engineered Substrates for High-Voltage Power Devices

Séverin Rouchier, G. Gaudin, J. Widiez et al. · Materials science forum · 2022 · 24 citations · Full text

Sic Wafers, Electrical Engineering, Electronic Devices +15

Self-Assembly Process for 3D Die-to-Wafer using Direct Bonding: A Step Forward Toward Process Automatisation

A. Jouve, Loïc Sanchez, C. Castan et al. · 2019 · 10 citations