P. Nolmans

Ultra-Fine Pitch 3D Integration Using Face-to-Face Hybrid Wafer Bonding Combined with a Via-Middle Through-Silicon-Via Process

Soon-Wook Kim, Mikael Detalle, Lan Peng et al. · 2016 · 58 citations

Engineering, Materials Engineering, Materials Science +15

Implementation of an industry compliant, 5×50μm, via-middle TSV technology on 300mm wafers

A. Redolfi, Dimitrios Velenis, Sarasvathi Thangaraju et al. · 2011 · 52 citations

Engineering, Electrical Engineering, Manufacturing Processes +14

Hybrid 14nm FinFET - Silicon Photonics Technology for Low-Power Tb/s/mm ² Optical I/O

Michał Rakowski, Yuseok Ban, Peter De Heyn et al. · 2018 · 46 citations

Engineering, Electrical Engineering, Microelectronics +16

An electrostatic fringing-field actuator (EFFA): application towards a low-complexity thin-film RF-MEMS technology

Xavier Rottenberg, S. Brebels, P. Ekkels et al. · Journal of Micromechanics and Microengineering · 2007 · 38 citations

Engineering, Electrical Engineering, Materials Science +13

Effect of substrate charging on the reliability of capacitive RF MEMS switches

P. Czarnecki, Xavier Rottenberg, Philippe Soussan et al. · Sensors and Actuators A Physical · 2008 · 37 citations

Engineering, Electrical Engineering, Electromagnetics +11