Peng-Shu Chen

Performance and Process Comparison between Glass and Si Interposer for 3D-IC Integration

Chun-Hsien Chien, Ching-Kuan Lee, Hsun Yu et al. · IMAPSource Proceedings · 2013 · 43 citations

Engineering, Electrical Engineering, Materials Science +17

ABF-Based TSV Arrays With Improved Signal Integrity on 3-D IC/Interposers: Equivalent Models and Experiments

Chuen-De Wang, Yu-Jen Chang, Yi-Chang Lu et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2013 · 28 citations

Engineering, Electrical Engineering, Materials Science +17

Novel crosstalk modeling for multiple through-silicon-vias (TSV) on 3-D IC: Experimental validation and application to Faraday cage design

Yu-Jen Chang, Hao-Hsiang Chuang, Yi-Chang Lu et al. · 2012 · 23 citations

Engineering, Computer Engineering, Electrical Engineering +17

A Wafer-Level Three-Dimensional Integration Scheme With Cu TSVs Based on Microbump/Adhesive Hybrid Bonding for Three-Dimensional Memory Application

Cheng-Ta Ko, Zhi-Cheng Hsiao, Yao-Jen Chang et al. · IEEE Transactions on Device and Materials Reliability · 2012 · 22 citations

Engineering, Computer Engineering, Interface Science +16

An Electrical Testing Method for Blind Through Silicon Vias (TSVs) for 3D IC Integration

Shyh-Shyuan Sheu, Zhe-Hui Lin, Jui-Feng Hung et al. · Journal of Microelectronics and Electronic Packaging · 2011 · 21 citations

Engineering, Electrical Engineering, Microelectronics +16