Siu Cheung So

Surface Energy Characterization for Die-Level Cu Hybrid Bonding

Katsuyuki Sakuma, Roy Yu, Michael Belyansky et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 2022 · 14 citations

Voids-free Die-level Cu/ILD Hybrid bonding

Katsuyuki Sakuma, Roy Yu, Nicholas A. Polomoff et al. · 2023 · 14 citations

Plasma Activated Low-temperature Die-level Direct Bonding with Advanced Wafer Dicing Technologies for 3D Heterogeneous Integration

Katsuyuki Sakuma, Dishit P. Parekh, Michael Belyansky et al. · 2021 · 11 citations

Direct Die to Wafer Cu Hybrid Bonding for Volume Production

Chun Ho Fan, H. Ng, Siu Cheung So et al. · 2023 · 10 citations