Concepedia

Christian Nopper

CN

Statistics

Publications

4

Citations

270

H-Index

4

Active since

2010

Affiliations

STMicroelectronics (France)(Current)

Georgia Institute of Technology

Asahi Glass (Japan)

STMicroelectronics (Switzerland)

Christian Nopper is an author at STMicroelectronics (France) specializing in electronic packaging, microelectronics, and electrical engineering.

Top concepts

EngineeringMicroelectronicsElectronic PackagingElectrical Engineering3D PrintingApplied PhysicsMaterial ScienceAdvanced PackagingMicrofabricationAntenna

Publications per year

2010–2013

4

Publications

4

Through-package-via formation and metallization of glass interposers

Vijay Sukumaran, Qiao Chen, Fuhan Liu et al. · 2010 · 119 citations

Engineering, Silicon Interposers, Glass-ceramic +17

Design, fabrication and characterization of low-cost glass interposers with fine-pitch through-package-vias

Vijay Sukumaran, Tapobrata Bandyopadhyay, Qiao Chen et al. · 2011 · 81 citations

Package Vias, Engineering, Fine Pitch +21

Design and fabrication of bandpass filters in glass interposer with through-package-vias (TPV)

Vivek Sridharan, Sung-Hwan Min, Venky Sundaram et al. · 2010 · 41 citations

Advanced Packaging, Electrical Engineering, Engineering +9

Ultra-miniaturized and surface-mountable glass-based 3D IPAC packages for RF modules

Yoichiro Sato, Srikrishna Sitaraman, Vijay Sukumaran et al. · 2013 · 29 citations

Thin Glass Substrate, Engineering, Electromagnetic Compatibility +18

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