Concepedia

Kim Yess

KY

Statistics

Publications

4

Citations

69

H-Index

4

Active since

2008

Affiliations

Brewer Science (United States)(Current)

IMEC

SUSS MicroTec (Germany)

Kim Yess is an author at Brewer Science (United States) specializing in engineering, temporary bonding layers, and materials science.

Publications per year

2008–2019

4

Publications

4

The Growing Application Field of Laser Debonding: From Advanced Packaging to Future Nanoelectronics

Alain Phommahaxay, Gerald Beyer, Iuliana Radu et al. · 2019 · 23 citations

Engineering, Electrical Engineering, Materials Science +17

Extremely Low-Force Debonding of Thinned CMOS Substrate by Laser Release of a Temporary Bonding Material

Alain Phommahaxay, Goedele Potoms, Greet Verbinnen et al. · 2016 · 17 citations

Engineering, Electrical Engineering, Materials Science +14

A spin-on photosensitive polymeric etch protection mask for anisotropic wet etching of silicon

J. Dalvi-Malhotra, Xing-Fu Zhong, Curtis Planje et al. · Journal of Micromechanics and Microengineering · 2008 · 16 citations

Engineering, Materials Engineering, Materials Science +17

Advances in Temporary Carrier Technology for High-Density Fan-Out Device Build-up

Arnita Podpod, Alain Phommahaxay, Pieter Bex et al. · 2019 · 13 citations

Engineering, Electrical Engineering, Materials Engineering +17

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