William J. Dauksher - Concepedia

Author

William J. Dauksher

Also Known As

Bowden, S., W Dauksher, W. Dauksher, W. J. Dauksher, W.J. Dauksher, William Dauksher, William J Dauksher, William J. Dauksher

109

Publications

1.4K

Citations

H-Index

Concepts

All Affiliations

Motorola (United States)The University of Texas at Austin Arizona State University Physical Sciences (United States)NOAA Physical Sciences Laboratory

About

William J. Dauksher is an author at Motorola (United States) specializing in engineering, applied physics, and microfabrication.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	21	35	1.1K
2	Applied Physics	18	25	847
3	Natural Sciences	3	3	75
4	Medicine	1	1	11
5	Biomedical Engineering	1	1	13

William J. Dauksher

Publications

1.2K

Citations

H-Index

Page 1

	Year	Citations
Imprint lithography for integrated circuit fabrication Douglas J. Resnick, William J. Dauksher, David P. Mancini, Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena EngineeringMicromanufacturingIntegrated CircuitsWafer Scale ProcessingBeam Lithography	2003	120
Template fabrication schemes for step and flash imprint lithography T. C. Bailey, Douglas J. Resnick, David P. Mancini, Microelectronic Engineering Materials ScienceEngineeringBeam LithographyMicrofabricationFabrication Technique	2002	106
&gt;750 mV open circuit voltage measured on 50 <i>μ</i>m thick silicon heterojunction solar cell Stanislau Herasimenka, William J. Dauksher, Stuart Bowden Applied Physics Letters Electrical EngineeringSun IlluminationEngineeringSemiconductor DeviceSolar Power	2013	106
ITO/SiOx:H stacks for silicon heterojunction solar cells Stanislau Herasimenka, William J. Dauksher, Mathieu Boccard, Solar Energy Materials and Solar Cells Electrical EngineeringEngineeringOrganic Solar CellApplied PhysicsH Stacks	2016	69
Model for a multiple-step deep Si etch process Shahid Rauf, William J. Dauksher, Stephen Clemens, Journal of Vacuum Science & Technology A Vacuum Surfaces and Films Plasma ElectronicsEngineeringVlsi DesignProfile ModificationMicrofabrication	2002	52
Characterization of and imprint results using indium tin oxide-based step and flash imprint lithography templates William J. Dauksher, Kevin J. Nordquist, David P. Mancini, Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena Crystal StructureEngineeringImprint ResultsThin Film Process TechnologyNanoengineering	2002	43
High-resolution templates for step and flash imprint lithography Douglas J. Resnick, William J. Dauksher, David P. Mancini, Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE EngineeringElectron-beam LithographyMicroscopyComputer-aided DesignBeam Lithography	2002	43
Method for fabricating a low stress x-ray mask using annealable amorphous refractory compounds William J. Dauksher, Douglas J. Resnick, K. D. Cummings, Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena EngineeringX-ray MasksStress GradientsThin Film Process TechnologyStressed Refractory Material	1995	39
Distortion and overlay performance of UV step and repeat imprint lithography Jin Choi, Kevin J. Nordquist, Ashuman Cherala, Microelectronic Engineering Electron-beam LithographyBeam LithographyMicrofabricationRepeat Imprint LithographyUv Step	2005	38
Effects of etch barrier densification on step and flash imprint lithography Steve Johnson, Ryan L. Burns, E. K. Kim, Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena EngineeringElectron-beam LithographyMechanical EngineeringPattern TransferVolumetric Shrinkage	2005	36

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