C. Fürböck

Quantitative internal thermal energy mapping of semiconductor devices under short current stress using backside laser interferometry

D. Pogány, S. Bychikhin, C. Fürböck et al. · IEEE Transactions on Electron Devices · 2002 · 60 citations

Total Energy, Engineering, Short Current Stress +18

Scanning Heterodyne Interferometer Setup for the Time-Resolved Thermal and Free-Carrier Mapping in Semiconductor Devices

Martin Litzenberger, C. Fürböck, S. Bychikhin et al. · IEEE Transactions on Instrumentation and Measurement · 2005 · 35 citations

Engineering, Optical Transmission System, Optical Testing +21

Single-shot thermal energy mapping of semiconductor devices with the nanosecond resolution using holographic interferometry

D. Pogány, V. Dubec, S. Bychikhin et al. · IEEE Electron Device Letters · 2002 · 34 citations

Nanosecond Resolution, Engineering, Holographic Method +22

Thermal and free carrier concentration mapping during ESD event in smart Power ESD protection devices using an improved laser interferometric technique

C. Fürböck, Kai Esmark, Martin Litzenberger et al. · Microelectronics Reliability · 2000 · 33 citations

Electrical Engineering, Engineering, Esd Event +2

Interferometric temperature mapping during ESD stress and failure analysis of smart power technology ESD protection devices

C. Fürböck, D. Pogány, Martin Litzenberger et al. · Journal of Electrostatics · 2000 · 25 citations

Electrical Engineering, Reliability Engineering, Engineering +6