Keiji Oshima

Mechanism of plasma-induced damage to low-k SiOCH films during plasma ashing of organic resists

Keigo Takeda, Yudai Miyawaki, Seigo Takashima et al. · Journal of Applied Physics · 2011 · 40 citations

Materials Science, Materials Engineering, Chemical Engineering +15

Prediction of Fluctuations in Plasma–Wall Interactions Using an Equipment Engineering System

Masanaga Fukasawa, Atsushi Kawashima, Nobuyuki Kuboi et al. · Japanese Journal of Applied Physics · 2009 · 39 citations

Excess Deposition, Engineering, Etch Rate +13

Surface reactions during low-k etching using H2∕N2 plasma

Masanaga Fukasawa, Tetsuya Tatsumi, Keiji Oshima et al. · Journal of Vacuum Science & Technology A Vacuum Surfaces and Films · 2008 · 18 citations

Materials Science, Chemical Engineering, Engineering +12

Analysis of Plasma Wall Reactions Using Virtual Optical Emission Spectrometry Signal during Dielectric Etching

Nobuyuki Kuboi, Masanaga Fukasawa, Atsushi Kawashima et al. · Japanese Journal of Applied Physics · 2010 · 10 citations