Concepedia

S. Polamreddy

SP

Statistics

Publications

4

Citations

204

H-Index

4

Active since

2005

Affiliations

University of Arkansas at Fayetteville(Current)

S. Polamreddy is an author at University of Arkansas at Fayetteville specializing in electrical engineering, engineering, and integrated circuit fabrication.

Publications per year

2005–2007

4

Publications

4

Process integration for through-silicon vias

S. Spiesshoefer, Zia Ur Rahman, G. Vangara et al. · Journal of Vacuum Science & Technology A Vacuum Surfaces and Films · 2005 · 77 citations

, , +17

Architectural implications and process development of 3-D VLSI Z-axis interconnects using through silicon vias

L.W. Schaper, S. L. Burkett, S. Spiesshoefer et al. · IEEE Transactions on Advanced Packaging · 2005 · 65 citations

, , +17

Effect of process parameters on via formation in Si using deep reactive ion etching

I. U. Abhulimen, S. Polamreddy, S. L. Burkett et al. · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena · 2007 · 34 citations

, , +17

Copper electroplating to fill blind vias for three-dimensional integration

S. Spiesshoefer, Jaydeep Patel, Timothy T.-Y. Lam et al. · Journal of Vacuum Science & Technology A Vacuum Surfaces and Films · 2006 · 28 citations

, , +17

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