Ken Cheung

Statistics

Publications

Citations

177

H-Index

Active since

2002

Affiliations

Jiangyin Traffic Planning Survey & Design Institute (China)(Current)

ASM Pacific Technology (China)

Indium Corporation (United States)

Micron Corporation (United States)

Ken Cheung is an author at Jiangyin Traffic Planning Survey & Design Institute (China) specializing in fan-out wafer-level packaging, wafer-level packaging, and engineering.

Publications per year

2002–2017

Publications

Sintering of dental porcelain: effect of time and temperature on appearance and porosity

Ken Cheung, B.W. Darvell · Dental Materials · 2002 · 103 citations

Dentistry, Dental Materials Science, Ceramic Materials +11

Warpage and Thermal Characterization of Fan-Out Wafer-Level Packaging

John H. Lau, Ming Li, Dewen Tian et al. · 2017 · 44 citations

Engineering, Materials Engineering, Materials Science +17

Development of chip-first and die-up fan-out wafer level packaging

Xuan Hua, Hong Xu, Li Zhang et al. · 2017 · 19 citations

Engineering, Materials Engineering, Materials Science +17

Characterizations of Fan-out Wafer-Level Packaging

Ming Li, Qingqian Li, John H. Lau et al. · IMAPSource Proceedings · 2017 · 11 citations

Engineering, Manufacturing Engineering, Manufacturing Processes +15

1–4 of 4