Statistics
Publications
1
Citations
19
H-Index
1
Active since
2017
Affiliations
ASM Pacific Technology (China)(Current)
Hong Xu is an author at ASM Pacific Technology (China) specializing in die-to-wafer bonding, materials science, and semiconductor devices.
Publications per year
2017–2017
1
1
Development of chip-first and die-up fan-out wafer level packaging
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