Concepedia

Qingqian Li

QL

Statistics

Publications

6

Citations

153

H-Index

6

Active since

2013

Affiliations

City University of Hong Kong(Current)

International Charter School

Qingqian Li is an author at City University of Hong Kong specializing in materials engineering, natural sciences, and materials science.

Publications per year

2013–2017

6

Publications

6

Growth kinetics of the Cu3Sn phase and void formation of sub-micrometre solder layers in Sn–Cu binary and Cu–Sn–Cu sandwich structures

Qingqian Li, Y.C. Chan · Journal of Alloys and Compounds · 2013 · 56 citations

Natural Sciences, Materials Engineering, Materials Science +17

A study of Ag additive methods by comparing mechanical properties between Sn57.6Bi0.4Ag and 0.4 wt% nano-Ag-doped Sn58Bi BGA solder joints

Huayu Sun, Qingqian Li, Y.C. Chan · Journal of Materials Science Materials in Electronics · 2014 · 46 citations

Natural Sciences, Materials Engineering, Materials Science +11

Interfacial microstructure and hardness of nickel (Ni) nanoparticle-doped tin–silver–copper (Sn–Ag–Cu) solders on immersion silver (Ag)-plated copper (Cu) substrates

Tama Fouzder, Qingqian Li, Y.C. Chan et al. · Journal of Materials Science Materials in Electronics · 2014 · 18 citations

Natural Sciences, Materials Engineering, Materials Science +16

Study of microstructure evolution in novel Sn–Zn/Cu bi-layer and Cu/Sn–Zn/Cu sandwich structures with nanoscale thickness for 3D packaging interconnection

Qingqian Li, Y.C. Chan, Kaili Zhang et al. · Microelectronic Engineering · 2014 · 11 citations

Natural Sciences, Materials Engineering, Materials Science +15

Microstructure and kinetic analysis of the properties and behavior of nickel (Ni) nano-particle doped tin–zinc–bismuth (Sn–8Zn–3Bi) solders on immersion silver (Ag)-plated copper (Cu) substrates

Tama Fouzder, Qingqian Li, Y.C. Chan et al. · Journal of Materials Science Materials in Electronics · 2014 · 11 citations

Natural Sciences, Materials Engineering, Materials Science +16

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