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Microstructure and kinetic analysis of the properties and behavior of nickel (Ni) nano-particle doped tin–zinc–bismuth (Sn–8Zn–3Bi) solders on immersion silver (Ag)-plated copper (Cu) substrates

Materials ScienceChemical EngineeringEngineeringMetal NanoparticlesNanomaterialsNanotechnologySurface ScienceImmersion SilverNanostructure SynthesisKinetic Analysis