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Interfacial microstructure and hardness of nickel (Ni) nanoparticle-doped tin–silver–copper (Sn–Ag–Cu) solders on immersion silver (Ag)-plated copper (Cu) substrates

Materials ScienceEngineeringMetal NanoparticlesNanomaterialsNanotechnologyApplied PhysicsImmersion SilverMetallic NanomaterialsInterfacial MicrostructureNanoparticle-doped Tin–silver–copperMicrostructureMetal Processing