Gunrae Kim

Technology scaling on High-K & Metal-Gate FinFET BTI reliability

Kyong Taek Lee, Wonchang Kang, Eun-Ae Chung et al. · 2013 · 58 citations

Engineering, Electrical Engineering, Electronic Materials +16

Reliability characterization of 10nm FinFET technology with multi-V<inf>T</inf> gate stack for low power and high performance

Minjung Jin, Changze Liu, Jinju Kim et al. · 2016 · 26 citations

Engineering, Electrical Engineering, Microelectronics +16

Mass transfer characteristics of wire-mesh honeycomb reactors

Zhidong Jiang, Ki-Suk Chung, Gunrae Kim et al. · Chemical Engineering Science · 2003 · 25 citations

Engineering, Materials Science, Nuclear Engineering +14

Propensity of Copper Dendrite Growth on Subassembly Package Components Used in Quad Flat Package

Jongwoo Park, Yong-Bum Jo, Junekyun Park et al. · IEEE Transactions on Device and Materials Reliability · 2008 · 13 citations

Natural Sciences, Materials Engineering, Materials Science +10

New insights into 10nm FinFET BTI and its variation considering the local layout effects

Changze Liu, Minjung Jin, Taiki Uemura et al. · 2017 · 11 citations

Engineering, Computer Engineering, Electrical Engineering +17