Yong-Bum Jo

Interfacial Degradation Mechanism of Au/Al and Alloy/Al Bonds Under High Temperature Storage Test: Contamination, Epoxy Molding Compound, Wire and Bonding Strength

Jongwoo Park, Hyun-Joon Cha, Back-Sung Kim et al. · IEEE Transactions on Components and Packaging Technologies · 2007 · 24 citations

Natural Sciences, Materials Engineering, Materials Science +14

Mechanical properties of fully porous and porous-surfaced Ti–6Al–4V implants fabricated by electro-discharge-sintering

Yong-Bum Jo, C.M. Lee, H.S. Jang et al. · Journal of Materials Processing Technology · 2007 · 23 citations

Natural Sciences, Materials Engineering, Materials Science +13

Consolidation of mechanical alloyed Ti–37.5at.% Si powder mixture using an electro-discharge technique

Yong-Il Cheon, Yong-Bum Jo, C.M. Lee et al. · Materials Science and Engineering A · 2007 · 16 citations

Engineering, Materials Engineering, Materials Science +13

Formation of porous metallic glass compacts by electro-discharge sintering

J.Y. Cho, J.S. Shin, Yong-Bum Jo et al. · Journal of Alloys and Compounds · 2011 · 14 citations

Natural Sciences, Materials Engineering, Materials Science +13

Propensity of Copper Dendrite Growth on Subassembly Package Components Used in Quad Flat Package

Jongwoo Park, Yong-Bum Jo, Junekyun Park et al. · IEEE Transactions on Device and Materials Reliability · 2008 · 13 citations

Natural Sciences, Materials Engineering, Materials Science +10