I. Debusschere

3D stacked IC demonstration using a through Silicon Via First approach

J. Van Olmen, A. Mercha, Guruprasad Katti et al. · 2008 · 141 citations

Engineering, Computer Engineering, Electrical Engineering +17

A 1006 element hybrid silicon pixel detector with strobed binary output

F. Anghinolfi, P. Aspell, K. Bass et al. · IEEE Transactions on Nuclear Science · 1992 · 95 citations · Full text

Engineering, Nuclear Engineering, Nuclear Instrumentation +16

3D stacked ICs using Cu TSVs and Die to Wafer Hybrid Collective bonding

Guruprasad Katti, Ali Merç, J. Van Olmen et al. · 2009 · 66 citations

Engineering, Computer Engineering, Electrical Engineering +17

Highly Scaled Vertical Cylindrical SONOS Cell With Bilayer Polysilicon Channel for 3-D nand Flash Memory

G. Van den bosch, Gouri Sankar Kar, Pieter Blomme et al. · IEEE Electron Device Letters · 2011 · 46 citations

Engineering, Computer Engineering, Electrical Engineering +17

Impact of through silicon via induced mechanical stress on fully depleted Bulk FinFET technology

Wei Guo, Geert Van der Plas, Alojz Ivankoviç et al. · 2012 · 36 citations

Engineering, Electrical Engineering, Electronic Materials +16