Statistics
Publications
5
Citations
96
H-Index
5
Active since
2006
Affiliations
IBM (United States)(Current)
Klaus Ruhmer is an author at IBM (United States) specializing in materials science, microelectronics, and microfabrication.
Publications per year
2006–2014
5
5
Advancements in fabrication of glass interposers
Aric Shorey, Philippe Cochet, Alan Huffman et al. · 2014 · 41 citations
Materials Science, Materials Engineering, Electrical Engineering +14
50μm pitch Pb-free micro-bumps by C4NP technology
Bing Dang, Da‐Yuan Shih, Stephen L. Buchwalter et al. · 2008 · 20 citations
C4NP Lead Free Solder Bumping and 3D Micro Bumping
James Busby, David Hawken, E Perfecto et al. · 2008 · 13 citations
Engineering, Mechanical Engineering, Advanced Manufacturing +17
Alternative UBM for Lead Free Solder Bumping using C4NP
Klaus Ruhmer, Eric Laine, Kathy O’Donnell et al. · 2007 · 12 citations
Materials Engineering, Materials Science, Electrical Engineering +14
C4NP as a High-Volume Manufacturing Method for Fine-Pitch and Lead-Free FlipChip Solder Bumping
Eric Laine, Klaus Ruhmer, E Perfecto et al. · 2006 1st Electronic Systemintegration Technology Conference · 2006 · 10 citations
Materials Science, High-volume Manufacturing Method, Electrical Engineering +13
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