Statistics
Publications
3
Citations
32
H-Index
3
Active since
2006
Affiliations
IBM (United States)(Current)
Eric Laine is an author at IBM (United States) specializing in materials science, microfabrication, and microelectronics.
Publications per year
2006–2007
3
3
Alternative UBM for Lead Free Solder Bumping using C4NP
Klaus Ruhmer, Eric Laine, Kathy O’Donnell et al. · 2007 · 12 citations
Materials Engineering, Materials Science, Electrical Engineering +14
C4NP Technology for Lead Free Solder Bumping
Eric Laine, E Perfecto, Barrie Campbell et al. · 2007 · 10 citations
C4NP as a High-Volume Manufacturing Method for Fine-Pitch and Lead-Free FlipChip Solder Bumping
Eric Laine, Klaus Ruhmer, E Perfecto et al. · 2006 1st Electronic Systemintegration Technology Conference · 2006 · 10 citations
Materials Science, High-volume Manufacturing Method, Electrical Engineering +13
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