Statistics
Publications
2
Citations
23
H-Index
2
Active since
2007
Affiliations
IBM (United States)(Current)
James Busby is an author at IBM (United States) specializing in materials science, production engineering, and mechanical engineering.
Publications per year
2007–2008
2
2
C4NP Lead Free Solder Bumping and 3D Micro Bumping
James Busby, David Hawken, E Perfecto et al. · 2008 · 13 citations
Engineering, Mechanical Engineering, Advanced Manufacturing +17
C4NP Technology for Lead Free Solder Bumping
Eric Laine, E Perfecto, Barrie Campbell et al. · 2007 · 10 citations
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