David Hawken

Chip-to-package interaction for a 90 nm Cu / PECVD low-k technology

W. Landers, D. Edelstein, L. A. Clevenger et al. · 2004 · 25 citations

Chip-to-package Interaction, Nm Technology, Electrical Engineering +15

Comprehensive reliability evaluation of a 90 nm CMOS technology with Cu/PECVD low-k BEOL

D. Edelstein, H. Rathore, C. Davis et al. · 2004 · 23 citations

Engineering, Chip-package Reliability Stress, Interconnect (Integrated Circuits) +20

C4NP technology: Manufacturability, yields and reliability

E Perfecto, David Hawken, Hai P. Longworth et al. · 2008 · 22 citations

Miniaturization, Engineering, Industrial Engineering +16

Reliability, yield, and performance of a 90 nm SOI/Cu/SiCOH technology

D. Edelstein, C. Davis, L. A. Clevenger et al. · 2004 · 18 citations

Engineering, Vlsi Design, Chip-package Reliability +16

C4NP Lead Free Solder Bumping and 3D Micro Bumping

James Busby, David Hawken, E Perfecto et al. · 2008 · 13 citations

Engineering, Mechanical Engineering, Advanced Manufacturing +17