Concepedia

Hai P. Longworth

HP

Statistics

Publications

8

Citations

266

H-Index

8

Active since

1987

Affiliations

IBM (United States)(Current)

Massachusetts Institute of Technology

Hai P. Longworth is an author at IBM (United States) specializing in engineering, materials science, and electronic packaging.

Top concepts

EngineeringMaterial ScienceElectronic PackagingMaterials EngineeringElectrical EngineeringMechanical EngineeringMicrostructureMicroelectronicsCorrosionMicrofabrication

Publications per year

1987–2014

8

Publications

8

Abnormal grain growth in aluminum alloy thin films

Hai P. Longworth, Carl V. Thompson · Journal of Applied Physics · 1991 · 106 citations

Materials Science, Materials Engineering, Aluminium Nitride +14

An advanced multichip module (MCM) for high-performance UNIX servers

John Knickerbocker, Frank Pompeo, Asuka Tai et al. · IBM Journal of Research and Development · 2002 · 46 citations

Engineering, Computer Architecture, Integrated Circuits +21

Experimental study of electromigration in bicrystal aluminum lines

Hai P. Longworth, Carl V. Thompson · Applied Physics Letters · 1992 · 34 citations · Full text

Engineering, Mechanical Engineering, Electrometallurgy +18

C4NP technology: Manufacturability, yields and reliability

E Perfecto, David Hawken, Hai P. Longworth et al. · 2008 · 22 citations

Miniaturization, Engineering, Industrial Engineering +16

Effects of alloying additions of titanium, molybdenum, silicon, hafnium and tantalum on the microstructure of iron aluminides near Fe3Al

Hai P. Longworth, D.E. Mikkola · Materials Science and Engineering · 1987 · 20 citations

Materials Science, Materials Engineering, Engineering +7

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