J. Cervenka

A Comprehensive TCAD Approach for Assessing Electromigration Reliability of Modern Interconnects

H. Ceric, Roberto Lacerda de Orio, J. Cervenka et al. · IEEE Transactions on Device and Materials Reliability · 2008 · 54 citations

Engineering, Electrical Engineering, Materials Science +17

Hot-carrier degradation caused interface state profile—Simulation versus experiment

Ivan A. Starkov, Stanislav Tyaginov, H. Enichlmair et al. · Journal of Vacuum Science & Technology B Nanotechnology and Microelectronics Materials Processing Measurement and Phenomena · 2011 · 33 citations

Engineering, Electrical Engineering, Materials Science +17

Hot-carrier degradation modeling using full-band Monte-Carlo simulations

Stanislav Tyaginov, Ivan A. Starkov, O. Triebl et al. · 2010 · 26 citations

Engineering, Electrical Engineering, Electronic Materials +16

Anisotropic Mesh Refinement for the Simulation of Three-Dimensional Semiconductor Manufacturing Processes

W. Wessner, J. Cervenka, Clemens Heitzinger et al. · IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems · 2006 · 11 citations

Computing, Computational Engineering, Manufacturing Engineering +17

Numerical constraints and non-spatial open boundary conditions for the Wigner equation

Robert Kosik, J. Cervenka, Hans Kosina · Journal of Computational Electronics · 2021 · 11 citations · Full text

Natural Sciences, Electrical Engineering, Physics +15