Eddie Acosta

Progress of 3D Integration Technologies and 3D Interconnects

Scott Pozder, Ritwik Chatterjee, Ankur Jain et al. · 2007 · 60 citations

Engineering, Electrical Engineering, Microelectronics +16

Three dimensional chip stacking using a wafer-to-wafer integration

Ritwik Chatterjee, Marc Zussy, Antonio Roman et al. · 2007 · 38 citations

Engineering, Electrical Engineering, Materials Science +17

Electromigration of Cu-Sn-Cu micropads in 3D interconnect

Zhihong Huang, Ritwik Chatterjee, Patrick Justison et al. · 2008 · 27 citations

Engineering, Electrical Engineering, Materials Science +17

3D Die-to-wafer Cu/Sn Microconnects Formed Simultaneously with an Adhesive Dielectric Bond Using Thermal Compression Bonding

Scott Pozder, Ankur Jain, Ritwik Chatterjee et al. · 2008 · 19 citations

Engineering, Materials Engineering, Materials Science +17

On the Effect of Thermomechanical Processing on the Mechanical Properties of 2297 Plates

Eddie Acosta, O. López de Viñaspre García, A. Dakessian et al. · Materials science forum · 2002 · 10 citations · Full text

Engineering, Materials Engineering, Mechanical Engineering +14