Scott Pozder

Analytical and Numerical Modeling of the Thermal Performance of Three-Dimensional Integrated Circuits

Ankur Jain, Robert E. Jones, Ritwik Chatterjee et al. · IEEE Transactions on Components and Packaging Technologies · 2009 · 170 citations

Numerical Analysis, Engineering, Integrated Circuits +24

Analysis of flip-chip packaging challenges on copper/low-k interconnects

L.L. Mercado, Cindy Goldberg, Shun-Meen Kuo et al. · IEEE Transactions on Device and Materials Reliability · 2003 · 82 citations

Materials Engineering, Materials Science, Electrical Engineering +14

Electrical modeling and characterization of through-silicon vias (TSVs) for 3-D integrated circuits

Ioannis Savidis, Syed M. Alam, Ankur Jain et al. · Microelectronics Journal · 2009 · 80 citations

Electroforming and resistive switching in silicon dioxide resistive memory devices

Burt Fowler, Yao‐Feng Chang, Fei Zhou et al. · RSC Advances · 2015 · 68 citations

Non-volatile Memory, Electrical Engineering, Engineering +13

Thermal modeling and design of 3D integrated circuits

Ankur Jain, Robert E. Jones, Ritwik Chatterjee et al. · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems · 2008 · 65 citations

Engineering, Integrated Circuits, Interconnect (Integrated Circuits) +19