S. Lee

Advancing 2D Monolayer CMOS Through Contact, Channel and Interface Engineering

C. J. Dorow, Ashish Verma Penumatcha, K. Maxey et al. · 2021 IEEE International Electron Devices Meeting (IEDM) · 2021 · 112 citations

Engineering, Electrical Engineering, Materials Science +17

Effect of Pressure, Subcooling, and Dissolved Gas on Pool Boiling Heat Transfer From Microporous Surfaces in FC-72

Kevin Rainey, S. M. You, S. Lee · Journal of Heat Transfer · 2003 · 109 citations

Engineering, Materials Science, Mechanical Engineering +15

Gate length scaling beyond Si: Mono-layer 2D Channel FETs Robust to Short Channel Effects

C. J. Dorow, Ashish Verma Penumatcha, A. Kitamura et al. · 2022 International Electron Devices Meeting (IEDM) · 2022 · 49 citations

Engineering, Electrical Engineering, Materials Science +13

300 mm MOCVD 2D CMOS Materials for More (Than) Moore Scaling

K. Maxey, Carl H. Naylor, Ashish Verma Penumatcha et al. · 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) · 2022 · 34 citations

Engineering, Materials Engineering, Materials Science +17

Enabling high-performance mixed-signal system-on-a-chip (SoC) in high performance logic CMOS technology

L.M. Franca-Neto, Patrick Pardy, Montliy Ly et al. · 2003 · 29 citations

Engineering, Computer Engineering, Electrical Engineering +17