L. Li

Wetting reaction versus solid state aging of eutectic SnPb on Cu

K. N. Tu, T. Y. Lee, J. W. Jang et al. · Journal of Applied Physics · 2001 · 117 citations

Natural Sciences, Materials Engineering, Materials Science +17

Electrical conduction models for isotropically conductive adhesive joints

L. Li, James E. Morris · IEEE Transactions on Components Packaging and Manufacturing Technology Part A · 1997 · 105 citations

Natural Sciences, Materials Engineering, Materials Science +17

Characterization of lead-free solders and under bump metallurgies for flip-chip package

Jong‐Kai Lin, A. De Silva, D. R. Frear et al. · IEEE Transactions on Electronics Packaging Manufacturing · 2002 · 39 citations

Natural Sciences, Materials Engineering, Materials Science +17

Stencil printing process development for flip chip interconnect

L. Li, Patrick Thompson · IEEE Transactions on Electronics Packaging Manufacturing · 2000 · 31 citations

Engineering, Manufacturing Engineering, Materials Engineering +14

Wafer level and flip chip design through solder prediction models and validation

L. Li, Betty Yeung · IEEE Transactions on Components and Packaging Technologies · 2001 · 13 citations

Engineering, Materials Engineering, Materials Science +13