Yukihiro Shimogaki

Cu Wettability and Diffusion Barrier Property of Ru Thin Film for Cu Metallization

Hoon Kim, Toshihiko Koseki, Takayuki Ohba et al. · Journal of The Electrochemical Society · 2005 · 150 citations

Materials Science, Electromigration Technique, Engineering +14

Chemical reaction engineering in the design of CVD reactors

Hiroshi Komiyama, Yukihiro Shimogaki, Yasuyuki Egashira · Chemical Engineering Science · 1999 · 69 citations

Process Design, Chemical Engineering, Chemical Kinetics +6

Preparation of Low-Dielectric-Constant F-Doped SiO₂ Films by Plasma-Enhanced Chemical Vapor Deposition

Sangwoo Lim, Yukihiro Shimogaki, Yoshiaki Nakano et al. · Japanese Journal of Applied Physics · 1996 · 61 citations

Materials Science, Interlayer Film Results, Electrical Engineering +15

Hot-wire-assisted atomic layer deposition of a high quality cobalt film using cobaltocene: Elementary reaction analysis on NH<i>x</i> radical formation

Hideharu Shimizu, Kaoru Sakoda, Takeshi Momose et al. · Journal of Vacuum Science & Technology A Vacuum Surfaces and Films · 2011 · 52 citations

Materials Science, Precursor Feed Period, Chemical Engineering +12

Conformal Deposition and Gap-Filling of Copper into Ultranarrow Patterns by Supercritical Fluid Deposition

Takeshi Momose, Masakazu Sugiyama, Eiichi Kondoh et al. · Applied Physics Express · 2008 · 52 citations

Materials Science, Angled Polishing, Engineering +14