Tzvy-Jang Tseng

Chip-Last (RDL-First) Fan-Out Panel-Level Packaging (FOPLP) for Heterogeneous Integration

John H. Lau, Cheng-Ta Ko, Chia-Yu Peng et al. · Journal of Microelectronics and Electronic Packaging · 2020 · 23 citations · Full text

Engineering, Computer Architecture, Panel-level Packaging +17

Fan-Out (RDL-First) Panel-Level Hybrid Substrate for Heterogeneous Integration

John H. Lau, Gary Chang-Fu Chen, Jones Yu-Cheng Huang et al. · 2021 · 20 citations

Engineering, Panel-level Hybrid Substrate, Device Integration +20

Fan-Out Panel-Level Packaging of Mini-LED RGB Display

John H. Lau, Cheng-Ta Ko, Curry Lin et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2021 · 17 citations

Advanced Packaging, Electrical Engineering, Solid-state Lighting +14

Ultra-thin line embedded substrate manufacturing for 2.1D/2.5D SiP application

Yuhua Chen, Shyh-Lian Cheng, Dyi-Chung Hu et al. · 2015 · 14 citations

Ultra-thin Line, Engineering, Integrated Circuits +17

20" x 20" Panel Size Glass IPD Interposer Manufacturing

Yuhua Chen, Chun-Hsien Chien, Yu-Chung Hsieh et al. · 2016 · 13 citations

Ipd Industry, Engineering, Optical Glass +16