Olivier Pollet

Alternative process for thin layer etching: Application to nitride spacer etching stopping on silicon germanium

N. Possémé, Olivier Pollet, S. Barnola · Applied Physics Letters · 2014 · 52 citations

Engineering, Materials Engineering, Materials Science +15

Thin layer etching of silicon nitride: A comprehensive study of selective removal using NH3/NF3 remote plasma

N. Possémé, Vincent Ah-Leung, Olivier Pollet et al. · Journal of Vacuum Science & Technology A Vacuum Surfaces and Films · 2016 · 43 citations

Engineering, Materials Engineering, Materials Science +17

Seed layer enhancement by electrochemical deposition: The copper seed solution for beyond 45nm

A. Roule, M. Amuntencei, E. Deronzier et al. · Microelectronic Engineering · 2007 · 41 citations

Agriculture, Materials Engineering, Materials Science +13

Electroless deposition of CoWP: Material characterization and process optimization on 300mm wafers

Tifenn Decorps, Paul‐Henri Haumesser, S. Olivier et al. · Microelectronic Engineering · 2006 · 29 citations

Engineering, Materials Engineering, Materials Science +8

Experimental and theoretical understanding of Forming, SET and RESET operations in Conductive Bridge RAM (CBRAM) for memory stack optimization

J. Guy, G. Molas, P. Blaise et al. · 2014 · 26 citations

Engineering, Materials Engineering, Materials Science +17