Concepedia

Electroless deposition of CoWP: Material characterization and process optimization on 300mm wafers

Tifenn Decorps, Paul‐Henri Haumesser, S. Olivier, A. Roule, M. Joulaud, Olivier Pollet, Xavier Avale, G. Passemard

Microelectronic Engineering · 2006 · 29 citations · 2 references

DOI

Concepts

References

2

Relationship between interfacial adhesion and electromigration in Cu metallization

Michael Lane, E. Liniger, J. R. Lloyd · Journal of Applied Physics · 2003 · 294 citations

, , +13

Magnetic anisotropy, magnetostriction and intermediate range order in Co-P alloys

K. Hüller, M. Sydow, G. Dietz · Journal of Magnetism and Magnetic Materials · 1985 · 48 citations

, , +16