Hunter Chan

Through-package-via formation and metallization of glass interposers

Vijay Sukumaran, Qiao Chen, Fuhan Liu et al. · 2010 · 119 citations

Engineering, Silicon Interposers, Glass-ceramic +17

Design and fabrication of bandpass filters in glass interposer with through-package-vias (TPV)

Vivek Sridharan, Sung-Hwan Min, Venky Sundaram et al. · 2010 · 41 citations

Advanced Packaging, Electrical Engineering, Engineering +9

Chip-last embedded actives and passives in thin organic package for 1–110 GHz multi-band applications

Fuhan Liu, Venky Sundaram, Sung-Hwan Min et al. · 2010 · 31 citations

Engineering, Organic Electronics, Integrated Circuits +24

Ultra-high density, thin core and low loss organic system-on-package (SOP) substrate technology for mobile applications

Fuhan Liu, Venky Sundaram, Hunter Chan et al. · 2009 · 23 citations

Engineering, Organic Electronics, Ultra-high Density +22

Characterization of Next Generation Thin Low-K and Low-Loss Organic Dielectrics From 1 to 110 GHz

Seunghyun Hwang, Sung-Hwan Min, Madhavan Swaminathan et al. · IEEE Transactions on Advanced Packaging · 2009 · 17 citations

Engineering, Organic Electronics, Low-loss Organic Dielectrics +17