Jeffery C. C. Lo

Design, Materials, Process, Fabrication, and Reliability of Fan-Out Wafer-Level Packaging

John H. Lau, Ming Li, Qingqian Margie Li et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2018 · 91 citations

Advanced Packaging, Electrical Engineering, Chip-scale Package +15

Fan-Out Wafer-Level Packaging for Heterogeneous Integration

John H. Lau, Ming Li, Margie Li Qingqian et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2018 · 83 citations

3D Ic Architecture, Electrical Engineering, New Assembly Process +15

Microhardness and microstructure of ion-beam-sputtered, nitrogen-doped NiFe films

Tong Wu, C. Hwang, Jeffery C. C. Lo et al. · Thin Solid Films · 1988 · 50 citations

Materials Science, Engineering, Applied Physics +4

Chip-First Fan-Out Panel-Level Packaging for Heterogeneous Integration

Cheng-Ta Ko, John H. Lau, Ming Li et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2018 · 47 citations

Engineering, Energy Efficiency, Computer Architecture +16

Fan-Out Wafer-Level Packaging (FOWLP) of Large Chip with Multiple Redistribution Layers (RDLs)

John H. Lau, Ming Li, Nelson Fan et al. · Journal of Microelectronics and Electronic Packaging · 2017 · 40 citations

Engineering, Computer Architecture, Wafer Scale Processing +17