S. Verrun

Mechanisms of copper direct bonding observed by in-situ and quantitative transmission electron microscopy

M. Legros, Thomas Signamarcheix, Laurent Bally et al. · Thin Solid Films · 2012 · 43 citations

Materials Science, Copper Oxide Materials, Engineering +9

First integration of Cu TSV using die-to-wafer direct bonding and planarization

Patrick Leduc, M. Assous, L. Di Cioccio et al. · 2009 · 23 citations

Engineering, Planarization Technique, Interconnect (Integrated Circuits) +18

An innovative die to wafer 3D integration scheme: Die to wafer oxide or copper direct bonding with planarised oxide inter-die filling

L. Di Cioccio, Pierric Gueguen, R. Taïbi et al. · 2009 · 20 citations

Integration Scheme, Engineering, Mechanical Engineering +19

3D Integration of CMOS image sensor with coprocessor using TSV last and micro-bumps technologies

P. Coudrain, D. Henry, A. Berthelot et al. · 2013 · 18 citations

Engineering, Face-to-back Integration Scheme, Integrated Circuits +17

3D integration technology for set-top box application

David Henry, S. Chéramy, Jean Charbonnier et al. · 2009 · 17 citations

Top Chip, Engineering, 3D Modeling +20