Statistics
Publications
3
Citations
186
H-Index
3
Active since
2006
Affiliations
Kayoko Shibata is an author at Oki Electric Industry (Japan) specializing in semiconductor devices, 3d integrated circuits, and chip packaging.
Publications per year
2006–2007
3
3
A 3D Packaging Technology for 4 Gbit Stacked DRAM with 3 Gbps Data Transfer
M. Kawano, Shiro Uchiyama, Y. Egawa et al. · 2006 · 86 citations
Engineering, Computer Engineering, Electrical Engineering +17
Development of 3D-Packaging Process Technology for Stacked Memory Chips
T. Mitsuhashi, Y. Egawa, Osamu Kato et al. · MRS Proceedings · 2006 · 26 citations
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