A. Domenicucci

Reduced electromigration of Cu wires by surface coating

C.‐K. Hu, Lynne Gignac, R. Rosenberg et al. · Applied Physics Letters · 2002 · 215 citations

Materials Science, Electrical Engineering, Electromigration Technique +13

High Performance 45-nm SOI Technology with Enhanced Strain, Porous Low-k BEOL, and Immersion Lithography

P. Agnello, T. Ivers, C. Warm et al. · 2006 · 115 citations

Engineering, Vlsi Design, Enhanced Strain +21

Reduced Cu interface diffusion by CoWP surface coating

C.‐K. Hu, Lynne Gignac, R. Rosenberg et al. · Microelectronic Engineering · 2003 · 109 citations

Materials Science, Engineering, Corrosion +5

High performance 65 nm SOI technology with enhanced transistor strain and advanced-low-K BEOL

W.-H. Lee, Anya M. Waite, H. Nii et al. · 2006 · 55 citations

Engineering, Vlsi Design, Integrated Circuits +19

Thickness Dependence of Hole Mobility in Ultrathin SiGe-Channel p-MOSFETs

Cáit Ní Chléirigh, N. David Theodore, Hirofumi Fukuyama et al. · IEEE Transactions on Electron Devices · 2008 · 44 citations

Semiconductors, Semiconductor Technology, Electrical Engineering +14